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NTLUF4189NZ
Power MOSFET and
Schottky Diode
30 V, N ? Channel with 0.5 A Schottky
Barrier Diode, 1.6 x 1.6 x 0.55 mm
m Cool t Package
Features
? Low Qg and Capacitance to Minimize Switching Losses
? Low Profile UDFN 1.6x1.6 mm for Board Space Saving
? Low VF Schottky Diode
? ESD Protected Gate
? This is a Halide ? Free Device
? This is a Pb ? Free Device
V (BR)DSS
30 V
http://onsemi.com
MOSFET
R DS(on) MAX
200 m W @ 4.5 V
250 m W @ 3.0 V
350 m W @ 2.5 V
I D MAX
1.5 A
0.5 A
0.5 A
Applications
? DC-DC Boost Converter
? Color Display and Camera Flash Regulators
? Optimized for Power Management Applications for Portable
Products, such as Cell Phones, PMP, DSC, GPS, and others
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Symbol
Value
Units
V R MAX
30 V
SCHOTTKY DIODE
V F TYP
0.52 V
D
A
I F MAX
0.5 A
Drain-to-Source Voltage
Gate-to-Source Voltage
V DSS
V GS
30
± 8.0
V
V
G
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
t ≤ 5s
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
I D
P D
1.5
1.1
1.9
0.8
A
W
S
N ? Channel MOSFET
K
Schottky Diode
MARKING
DIAGRAM
Continuous Drain
Current (Note 2)
t ≤ 5s
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
I D
1.3
1.2
0.9
A
1
6
UDFN6
CASE 517AT
m COOL t
1
AA M G
G
Power Dissipation (Note 2) T A = 25 ° C
Pulsed Drain Current tp = 10 m s
MOSFET Operating Junction and Storage
Temperature
Schottky Operating Junction & Storage
Temperature
P D
I DM
T J ,
T STG
T J ,
T STG
0.5
8.0
-55 to
150
-55 to
125
W
A
° C
° C
AA = Specific Device Code
M = Date Code
G = Pb ? Free Package
PIN CONNECTIONS
6
1
S
Source Current (Body Diode) (Note 2) I S 1.5 A
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Gate-to-Source ESD Rating ESD 1000 V
(HBM) per JESD22 ? A114F
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm 2 , 2 oz. Cu.
K
A K
N/C 2 5 G
D
D 3 4
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2009
March, 2009 ? Rev. 1
1
Publication Order Number:
NTLUF4189NZ/D
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